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3E//NEWS

Latest news

Mar 13, 2012

EXFO Adds Bonded DSL Testing Capability to the MaxTester Series

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the launch of the MaxTester 630, featuring a new-generation Broadcom VDSL2/ADSL2+ chipset. This enhanced DSL multiplay tester enables service providers to save time and reduce repeat faults by letting them test multiple xDSL technologies within a single, dedicated solution. ...

Feb 17, 2012

EXFO Extends OTDR-Based iOLM Technology to Access and LAN/WAN Networks and Data Centers

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the integration of its proprietary iOLM technology to the FTB-720 LAN/WAN Access test module. Thanks to the added features, the new FTB-720 iOLM speeds up and simplifies optical fiber assessment within access and LAN/WAN networks, as well as data centers.


Feb 17, 2012

EXFO Brings Unmatched Cloud and Mobile Backhaul Service Reliability with EtherSAM Burst Testing

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the addition of burst testing functionalities to its award-winning Ethernet field-testing instruments. As part of its unique, ITU-T-compliant EtherSAM (Y. ...
3E//EVENT

Latest events

PMAT
Photonics Assembly

PMAT Photonics Assembly

AEi has developed an extensive set of active alignment and test algorithms for the PMAT platform that are easily configured as needed for specific products and applications using the FlexAuto control software. The modular design of the PMAT platform with many available sub-systems also allows users to select the appropriate tools for the manufacturing processes and technologies they need to deploy.

Features

  • 6 Degree of Freedom (DOF) active alignment (single sided or dual sided) for improved product performance with alignment to within as little as +/- 0.1 micron of peak coupling efficiency
  • Automated AEi alignment algorithms include raster scan, box scan, spiral scan, line scan, 2D downhill simplex, and 3D downhill simplex
  • Configurable and customizable alignment and testing sequencing
  • Support for a wide variety of instrumentation
  • Automated laser welding option
  • Automated epoxy dispense option
  • Configurable UV cure wands for optimal automated epoxy cure
  • Automated material handling available in different formats
  • Significantly faster cycle time, process repeatability, and improved production yield versus manual methods

Applications

  • MEMS Assembly
  • Planar Photonics Device Alignment and Test
  • Single Channel Photonics Device Alignment and Assembly
  • Fiber & fiber ribbon alignment applications
  • Assembly of DPSS-Laser