EXFO Adds Bonded DSL Testing Capability to the MaxTester Series

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the launch of the MaxTester 630, featuring a new-generation Broadcom VDSL2/ADSL2+ chipset. This enhanced DSL multiplay tester enables service providers to save time and reduce repeat faults by letting them test multiple xDSL technologies within a single, dedicated solution. ...

EXFO Extends OTDR-Based iOLM Technology to Access and LAN/WAN Networks and Data Centers

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the integration of its proprietary iOLM technology to the FTB-720 LAN/WAN Access test module. Thanks to the added features, the new FTB-720 iOLM speeds up and simplifies optical fiber assessment within access and LAN/WAN networks, as well as data centers.

EXFO Brings Unmatched Cloud and Mobile Backhaul Service Reliability with EtherSAM Burst Testing

EXFO Inc. (NASDAQ: EXFO) (TSX: EXF) announced today the addition of burst testing functionalities to its award-winning Ethernet field-testing instruments. As part of its unique, ITU-T-compliant EtherSAM (Y. ...

LDC-5000

Laser Diode Characterization System

the LBC 5000 Laser Diode Characterization System is specifically designed to test and characterize mounted single diode laser and LEDs.

FF360

Nanofoot FF360 is a state of the art instrument for emitted light far field scanning and profiling. The scanner is a compact stand-alone module with fully integrated electronics and opto- mechanics.

LBC-8000

Laser Diode Characterization System
The LDC / LBC System Family is a fully configurable, all in one laser diode, LED and laser diode bar characterization system platform for R&D laboratories and industry use.

CMAT-1 | CMAT-2

CMAT - Camera Assembly

The CMAT (Camera Module Align, Assembly and Test) platform is designed specifically for precision assembly and testing of digital camera modules and sensors.

PMAT - Photonics Assembly

The PMAT (Photonics Module Align, Assembly and Test) platform is designed specifically for precision alignment, assembly and testing of photonic or optoelectronic packages. This includes both single channel applications as well multi-channel packages such as AWGs and PLCs.